Bill No.:         HB0002                                             Drafter: DRN

LSO No.:       14LSO-0168                                     Effective Date: 7/1/2014

Enrolled Act No.:    HEA0001

Chapter No.:                        CH0015

Prime Sponsor:       Joint Education Interim Committee

Catch Title:              Bonded indebtedness mill levy supplement.

Subject:                     Repealing the bonded indebtedness mill levy supplement.

Summary/Major Elements:

· The act eliminates the bonded indebtedness mill levy supplement and capital leasing grant programs for school capital construction.

· All bonds issued under this provision are fully executed and this was a remnant of the previous financing scheme for school capital construction.